Study on Particle Adhesion and Removal Mechanisms in Post-CMP Cleaning Processes
碩士 === 國立中興大學 === 機械工程學系 === 92 === Particle removal by non-contact brush scrubbing for the post-CMP cleaning is investigated analytically. The removal s of SiO2 and Al2O3 particle adherent on SiO2 film coated on the wafer surface are considered. The cleaning fluid (H2O / NH4OH = 1:25 and...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00658036058947459418 |