The effects of electroplating on R-chip process
碩士 === 義守大學 === 材料科學與工程學系 === 92 === The thesis is to investigate how electroplating affects R-Chip process. The method is to analysis the plating bath problems by using barrel plating equipment and Hull-Cell device. The research shows that all of lead-free (non-lead) chemical will bring...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/62653290457312995366 |
| Summary: | 碩士 === 義守大學 === 材料科學與工程學系 === 92 === The thesis is to investigate how electroplating affects R-Chip process. The method is to analysis the plating bath problems by using barrel plating equipment and Hull-Cell device.
The research shows that all of lead-free (non-lead) chemical will bring Sn4+, but the difference between each other is the growing rate. The Sn4+ will affect the deposit thickness and change the grain structure. This can lead to worse solder ability of R-chip, and then affects the product quality. Those parameters could be the very good reference for electroplating engineers who work at passive component industry.
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