A Study on SDRAM Product Burn-In Time
碩士 === 中原大學 === 工業工程研究所 === 92 === Abstract Recently, the semiconductor industrial markets are expanding rapidly. To survive on the competive markets, one must enhance the manufacturing technology and improve the quality and reliability. Cost issue must be considered as well. The purpose of this st...
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2004
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Online Access: | http://ndltd.ncl.edu.tw/handle/4qeecd |
Summary: | 碩士 === 中原大學 === 工業工程研究所 === 92 === Abstract
Recently, the semiconductor industrial markets are expanding rapidly. To survive on the competive markets, one must enhance the manufacturing technology and improve the quality and reliability. Cost issue must be considered as well. The purpose of this study is to generate an optimal Burn-In strategy that can meet the reliability requirement and minimizes the Burn-In cost. The first issue of Burn-In study is “What is the product life time statistical distribution type”. This study performs the goodness of fit test and base on goodness of fit test result confirms to the statistical distribution assumption. The other issue is how to determine the Burn-In time. This study considers the “Reliability Objective Model” and “Minimize Cost Model”under general condition and Burn-In error condition. Finally, sensitive analysis is done to alalyze the optimal Burn-In time.
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