Analysis and Study of Modular Burn-in Socket for IC
碩士 === 中華大學 === 機械與航太工程研究所 === 92 === For the purpose of conquering the future dilemma the modular of sockets has been designed and fabricated for testing advanced BGA packaging. The socket can be custom designed to match variety of size, footprint and pitch. This modular socket consists of cover,...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37961215991617446137 |