Analysis and Study of Modular Burn-in Socket for IC

• Main Authors: Yao-Hsiang Wang, 王耀祥
• Other Authors: Ching-I Chen
• Format: Others
• Language: zh-TW
• Published: 2004
• Online Access: http://ndltd.ncl.edu.tw/handle/37961215991617446137

碩士 === 中華大學 === 機械與航太工程研究所 === 92 === For the purpose of conquering the future dilemma the modular of sockets has been designed and fabricated for testing advanced BGA packaging. The socket can be custom designed to match variety of size, footprint and pitch. This modular socket consists of cover, depressor, adaptor, spring unit, interposer, contact pin and base which provided a very simple structure, easily installation and maintenance, low cost and custom size. The most important highlight is the pitch can reach under 0.4 mm which satisfies the future requirement and challenge. In order to realize the mechanism of design process, a size of IC with 8×13, CSP BGA, 60 balls, 54 pins is addressed here. A series testing are performed to assure the performance and the characteristic of the sockets. There are Socket Dimensions Measurement, Durability Test, Temperature Life Test, Solder Ball Deformation, Cycle Test, Contact Inductance & Capacitance Measurement. The structural components design is analyzed by finite element method with ANSYS software to estimate the life and reliability of the socket and to understand the mechanical behavior. The success of this study will be seen the production of socket in the IC testing market with low cost and high performance possibly. Through the exploring process of the analysis, the knowledge and technology are developed to upgrade the semiconductor industry in our country.