A Study of Au-Si Eutectic Bonding with Embedded Barrier Layers and Plasma Treatment
碩士 === 中華大學 === 電機工程學系碩士班 === 92 === The wafer bonding technology has been extensively utilized in the microelectromechanical system (MEMS) for the packaging of micro sensors and micro actuators. Wafer bonding is a convenient joining technology, which involves fusion bonding, anodic bonding, polymer...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/95856556042884756936 |