The study of the laser direct writing on metal machining and polishing

碩士 === 國立中正大學 === 機械系 === 92 === Abstract One of the trends on developing Precision Metallic Mold Manufacture Technology in past ten years was to use high-speed turning to process hard milling of harden steel, but it was restricted to the diameter of the milling head. For insta...

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Bibliographic Details
Main Authors: chi chao nan, 紀兆南
Other Authors: 陳政雄
Format: Others
Language:zh-TW
Published: 2004
Online Access:http://ndltd.ncl.edu.tw/handle/39806183943893268871
Description
Summary:碩士 === 國立中正大學 === 機械系 === 92 === Abstract One of the trends on developing Precision Metallic Mold Manufacture Technology in past ten years was to use high-speed turning to process hard milling of harden steel, but it was restricted to the diameter of the milling head. For instance, when we work on the minimal marks, which are below 0.1mm, all of manufacture accuracy and efficiency cannot be reached; therefore, we often use Precision Electrical Discharge Machining during the follow up process. In short, the purpose of this paper is to apply Nd:YAG laser to laser mirco-structure manufacture and laser polishing technology, and to integrate the both as well. If we apply high power density to ablation 3D structure instead of traditional Precision Electrical Discharge Machining technology by setting up Nd:YAG laser setting on the Manufacturing Machinery, and integrate the laser polishing technology into the manufacture technology, we can reduce the following structure surface polishing and human resources as well. Accordingly, no matter the micro-machining, manufacture accuracy, the cost, or the delivery date are all making much more progress than those of the traditional process on metallic mold. Finally, the importance and particularity of this research was manifested through this 3D mirco material removing by laser ablation and laser polishing. Be confirmed by the experiments, the height of Recasting could be reduced by 8-17 m through adding Ar gas as an auxiliary, and the groove width could be also attenuated as well. Moreover, the new technology of polishing could reduce Ra from 5 m to 0.4 m.