The Study of Quality and Reliability of a Shipboard Satellite Communication Receiving System

• Main Authors: Shuen-Chin Shih, 施順欽
• Other Authors: Yun-Shiow Chen
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/49365857325291073003

碩士 === 元智大學 === 工業工程與管理學系 === 91 === The purpose of this research is to exploit the differences of product reliability predictions and to compare the advantages and disadvantages for three different standards and criteria, including the USA military standards, the Bell laboratory standards, and the Chinese reliability prediction standard. A shipboard satellite communication receiving system is used to study the difference among these three standards. The methodology adopted in this thesis includes: The characteristic analysis of the factors affecting equipment failure rates, the sensitivity analysis of parts, the weighting comparisons of the parts affecting equipments, and the evaluation explanation of the different reasons between the prediction values and practical application values. The main affecting factors considered quality, temperature, and electric stress. Both of the MIL- HDBK- 217 F and the Chinese Standard 299 B are more strict and concise for quality factor definitions. The Chinese Standard 299 B is more strict and concise for temperature factor definitions, and the Bellcore RPP is for electric stress factor definitions. The results of parts sensitivity analysis affecting equipment failure rates reveal that the most affected factors in the MIL- HDBK- 217 F, Bellcore RPP, and Chinese Standard 299 B are environmental, electric stress and environmental, respectively. In the weighting comparisons of the parts affecting equipment, we obtain switch devices (53.99%) in the MIL- HDBK- 217 F, IC chip (58.99%) in the Bellcore RPP, and IC chip (39.64%) in the Chinese Standard 299 B are the dominated weighting factors for the three standards. From this research, we hope the research results can be adopted by the manufacturer for the future research, development and manufacturing.