The Removal of Cu Ions of Wafter Surface on the Semiconductor Process by the Ozoned AmberliteXAD-4
碩士 === 國立臺北科技大學 === 材料及資源工程系碩士班 === 91 === Copper with its unique electric properties, such as lower resistance than Al and a high electromigration resistance, has been accepted as the material for the interconnect in high performance integrated circuits (ICs). Because Cu is not suitable for reactiv...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38778987834499939233 |