Evaluating WIP and Production Performance in Wafer Fabrication by Using Data Envelopment Analysis

碩士 === 東海大學 === 工業工程學系 === 91 === The change of WIP indicates the real situation of work field, production planner usually decides when to release order by checking the change of WIP. However, a suitable time to release order will make a huge affect of production performance. For this reason, this p...

Full description

Bibliographic Details
Main Authors: Yi-Chung Hsu, 徐一中
Other Authors: Li-Chih Wang
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/74056424730308200524
Description
Summary:碩士 === 東海大學 === 工業工程學系 === 91 === The change of WIP indicates the real situation of work field, production planner usually decides when to release order by checking the change of WIP. However, a suitable time to release order will make a huge affect of production performance. For this reason, this paper will use Data Envelopment Analysis to evaluate the relation of WIP control quantity and production performance in wafer fabrication. We make the use of analysis information to feedback to the primitive set of WIP control quantity in order to achieve a better performance. Under the assumption that all production condition in unchanged, we adjust total WIP control quantity, bottleneck loading, first pass bottleneck loading and expect to improve the performance of total output wafer, CVP, bottleneck group loading , bottleneck output. Afterwards, a hypothesis test will be practiced to examine whether the process is useful in correction of WIP quantity to make a better production performance