Study on Infrared System in Thermal Measurements for Central Processing Unit

• Main Authors: Yuan-pu Liao, 廖元溥
• Other Authors: 蔡敦仁
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/57472936728175503822

碩士 === 中國文化大學 === 資訊管理研究所 === 91 === In recent years due to rapid progress in semiconductor technology, the efficiency of Infrared Thermal Imaging Camera has been improved evidently but the product cost has been lowered. The technique of Infrared Thermal Imaging Camera has been developed and applied to various fields, such as electronic facility maintenance, concrete detect, medical treatment, chemical industry, military, and geography. However, until now the main detecting techniques used to examine the finished product in the field of Taiwan Computer Industry still heavily relied on human detecting. Therefore, the purpose of the study is attempt to apply the technique of Infrared Thermal Imaging Camera to product detecting in production line, taking CPU as an example, in order to raise the likelihood of precise detection to achieve better quality management for final finished product. In terms of, both vdd and frequency perfectly correlate with temperature; that is to say, according CMOS power consumption formula, theoretically the correlation coeffi-cient of the CPU’s temperature obtained from the experiment and vdd will be close to 1, and so will be the correlation coefficient of the CPU’s temperature and frequency. Based on the inference, the likelihood of disorder of the working CPU has will be lowered. The results fit with the original expectations. That is, comparing with defect CPU, the correlation coefficient of the normal CPU is closer to ideal value, 1. Therefore, this study applies the results to generate a preliminary IR-CPU Detecting System. It is expected that the research design of this study can be expended to other types of detecting equipments such as ultrasound, X-ray. In addition, temperature analysis module adopted in this study can be applied to other kinds of physical data besides temperature.