A study on the feasibility of electronic basic board for use manufactured by Kevlar fibers
碩士 === 中國文化大學 === 材料科學與製造研究所 === 91 === Recently the products of an electron make for small-scale、lightweight、thin type、high speed、high function、high density 、low prime cost , and the package technology of an electron also be to face high foot number、refined and integrated develop...
Main Authors: | Fu-Sung Yang, 楊福順 |
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Other Authors: | Huang-Kuei Lee |
Format: | Others |
Language: | zh-TW |
Published: |
2003
|
Online Access: | http://ndltd.ncl.edu.tw/handle/35422366214359503059 |
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