A study on the feasibility of electronic basic board for use manufactured by Kevlar fibers

碩士 === 中國文化大學 === 材料科學與製造研究所 === 91 === Recently the products of an electron make for small-scale、lightweight、thin type、high speed、high function、high density 、low prime cost , and the package technology of an electron also be to face high foot number、refined and integrated develop...

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Bibliographic Details
Main Authors: Fu-Sung Yang, 楊福順
Other Authors: Huang-Kuei Lee
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/35422366214359503059