| Summary: | 碩士 === 中國文化大學 === 材料科學與製造研究所 === 91 === Recently the products of an electron make for small-scale、lightweight、thin type、high speed、high function、high density
、low prime cost , and the package technology of an electron also be to face high foot number、refined and integrated develop
-ment , so it carries the weight of a component of an electron necessaries on printed circuit board technology requests also exacting day by day .
As a result of these days a side of a wire wide/ a crevice distance of multi-storey printed circuit board in Taiwan , already have 5-6 mil/5-6 mil ability of production , moreover , much more company of printed circuit board also have the blamed hole、the blind hole technology of High Density Interconnection
, they are mostly on communication territory application , and among which for Build-up is the most to gaze at a market, about correlation technology such as passing through a slight hole need Laser Via and Photo via technology、original material RCC technology、a soft material and FR-4、Aramid sheet material ect . advanced manufacturing、materials also to come with the tide of fashion .
Originally study introduce that wet type taked up the basic material of Kevlar fiber , to make use of it which steeped epoxy
resin to proceed fabrication Aramid basic board and to proceed test comparatively facing in weight、thickness、density、volume resistivity、surface resistivity、dielectric constant、dissipa
-tion factor ect , to evaluate possibility in industry applica
-tion.
Through study discovering , according to Taili Vinylon short
fiber in Kevlar fiber copy basic board that density increasing
,surface resistivity increasing , dielectric constant increasing
,dissipation factor increasing , and Kevlar 49 fiber add 5% Taili Vinylon paper material taked up the basic board are test excellent in density、volume resistivity、surface resistivity ; but in dielectric constant、dissipation factor , Kevlar 49 fiber add 15% SPC-5211 Vinylon paper material taked up the basic
board are well . therefore we know that Kevlar 49 fiber paper material add 5% Taili Vinylon paper material taked up the basic board in taked up paper、press down technology should proceed to research and produce. But in dielectric constant、dissipation
factor , they need to go a step further study and improve that function、beneficial result , to use as developing high perform
-ance basic board material .
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