W-Cu and Cu Heat Sinks Made by Powder Injection Molding Process
碩士 === 國立臺灣大學 === 材料科學與工程學研究所 === 91 === The recent development on computers is heavily focused on the thermal management due to the high heat generated by the powerful IC. To improve the heat dissipation capability, heat sink modules have been used widely, particularly the ones with cooling fins. T...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/14534699237148749598 |