The Study of Alumina Slurries and Polishing Model for Cu Chemical Mechanical Polishing
博士 === 國立臺灣大學 === 化學工程學研究所 === 91 === In this study, the effect of alumina slurries on Cu CMP has been investigated. It includes passivation, corrosion reactions and mechanical action. It has been found that the corrosion rate is reduced and the mechanical stress is cushioned by the formation of pas...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/65146325368767048113 |