The fabrication of Cu nanowire
碩士 === 國立清華大學 === 電子工程研究所 === 91 === We developed the electrochemical displacement method for Cu nanowire formed by replacing the silicon and the amorphous-silicon on SiO2/Si structure with electron beam lithography. The various line width from 0.1μm to 0.2μm were patterned by e-beam resi...
Main Authors: | Hong-Da Chang, 張宏達 |
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Other Authors: | Fon-Shan Huang |
Format: | Others |
Language: | zh-TW |
Published: |
2003
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Online Access: | http://ndltd.ncl.edu.tw/handle/45817584357578501894 |
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