3D Structure Design and Reliability Analysis of Wafer Level Package with Bubble-Like Stress Buffer Layer
碩士 === 國立清華大學 === 動力機械工程學系 === 91 === With the trend of multi-function and minimizing volume, original electronic package type has not met the performance of new-generation product. Consequently, new type packages based on WLP and CSP skills are developed to achieve the demand of reliabil...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/90187483529996963220 |