Temperature and bias ffect on wire-bond reliability for F1 & S2 type new wire evaluatione

碩士 === 國立中山大學 === 材料科學研究所 === 91 === none

Bibliographic Details
Main Authors: Chen-may Huang, 黃岑媺
Other Authors: Ker-Chang Hsieh
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/20379477546579426092

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