The correlation study between capillary profile and quality of gold ball bonding
碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 91 === Abstract As 0.13μm or smaller electric line width has been applied to the Integrated Circuit (IC), the “Bonding Pad Pitch” has been shrunk from earlier 100μm to 50μm. While the reduction is contributive to lower production cost, it also greatly influences...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/50138628215164845175 |