The correlation study between capillary profile and quality of gold ball bonding

碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 91 === Abstract As 0.13μm or smaller electric line width has been applied to the Integrated Circuit (IC), the “Bonding Pad Pitch” has been shrunk from earlier 100μm to 50μm. While the reduction is contributive to lower production cost, it also greatly influences...

Full description

Bibliographic Details
Main Authors: Cheng-Hsiang Yu, 尤承庠
Other Authors: Jerry Chih-Tsong Su
Format: Others
Language:zh-TW
Published: 2003
Online Access:http://ndltd.ncl.edu.tw/handle/50138628215164845175
id ndltd-TW-091NKIT5689006
record_format oai_dc
spelling ndltd-TW-091NKIT56890062016-06-22T04:20:20Z http://ndltd.ncl.edu.tw/handle/50138628215164845175 The correlation study between capillary profile and quality of gold ball bonding 銲針幾何參數設計與金球銲接品質關係之研究 Cheng-Hsiang Yu 尤承庠 碩士 國立高雄第一科技大學 機械與自動化工程所 91 Abstract As 0.13μm or smaller electric line width has been applied to the Integrated Circuit (IC), the “Bonding Pad Pitch” has been shrunk from earlier 100μm to 50μm. While the reduction is contributive to lower production cost, it also greatly influences “Ball Shear Force”. This report focuses on the correlation between capillary profile changes (Tip Diameter, Chamfer Diameter, Inner Chamfer Angel and Cone Angle) and the quality of gold ball bonding. First or all, I adopt gold ball size calculation to design the bonding ball size and then getting the machine parameters with “Thguchi Method”. Finally, “Central Composite Design” is used for the experiment of capillary parameters changed and bonding quality relationship. With “analysis of covariance”, “statically test” and “regression analysis” come out a regression equation that provides the 3-dimensional response diagram and contour plot. From the 3-dimensional response diagram, I reach a conclusion that tip diameter and cone angle of capillary parameter are the key factors that influence the bonding quality. As the tip diameter increases, size of ball increases but ball thickness decreases; ball sheer force increases first then decreases. As the cone angle decreased, the ball size increases and so does the ball sheer force, but ball thickness decreases. Experimental results can be applied to predict bonding quality and optimizing the capillary parameters in the condition of the decreased bonding pad pitch and when the modification of capillary parameter is needed. With modified capillary, bonding and measurement, it proves that experimental results were correct. Jerry Chih-Tsong Su 蘇啟宗 2003 學位論文 ; thesis 120 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 91 === Abstract As 0.13μm or smaller electric line width has been applied to the Integrated Circuit (IC), the “Bonding Pad Pitch” has been shrunk from earlier 100μm to 50μm. While the reduction is contributive to lower production cost, it also greatly influences “Ball Shear Force”. This report focuses on the correlation between capillary profile changes (Tip Diameter, Chamfer Diameter, Inner Chamfer Angel and Cone Angle) and the quality of gold ball bonding. First or all, I adopt gold ball size calculation to design the bonding ball size and then getting the machine parameters with “Thguchi Method”. Finally, “Central Composite Design” is used for the experiment of capillary parameters changed and bonding quality relationship. With “analysis of covariance”, “statically test” and “regression analysis” come out a regression equation that provides the 3-dimensional response diagram and contour plot. From the 3-dimensional response diagram, I reach a conclusion that tip diameter and cone angle of capillary parameter are the key factors that influence the bonding quality. As the tip diameter increases, size of ball increases but ball thickness decreases; ball sheer force increases first then decreases. As the cone angle decreased, the ball size increases and so does the ball sheer force, but ball thickness decreases. Experimental results can be applied to predict bonding quality and optimizing the capillary parameters in the condition of the decreased bonding pad pitch and when the modification of capillary parameter is needed. With modified capillary, bonding and measurement, it proves that experimental results were correct.
author2 Jerry Chih-Tsong Su
author_facet Jerry Chih-Tsong Su
Cheng-Hsiang Yu
尤承庠
author Cheng-Hsiang Yu
尤承庠
spellingShingle Cheng-Hsiang Yu
尤承庠
The correlation study between capillary profile and quality of gold ball bonding
author_sort Cheng-Hsiang Yu
title The correlation study between capillary profile and quality of gold ball bonding
title_short The correlation study between capillary profile and quality of gold ball bonding
title_full The correlation study between capillary profile and quality of gold ball bonding
title_fullStr The correlation study between capillary profile and quality of gold ball bonding
title_full_unstemmed The correlation study between capillary profile and quality of gold ball bonding
title_sort correlation study between capillary profile and quality of gold ball bonding
publishDate 2003
url http://ndltd.ncl.edu.tw/handle/50138628215164845175
work_keys_str_mv AT chenghsiangyu thecorrelationstudybetweencapillaryprofileandqualityofgoldballbonding
AT yóuchéngxiáng thecorrelationstudybetweencapillaryprofileandqualityofgoldballbonding
AT chenghsiangyu hànzhēnjǐhécānshùshèjìyǔjīnqiúhànjiēpǐnzhìguānxìzhīyánjiū
AT yóuchéngxiáng hànzhēnjǐhécānshùshèjìyǔjīnqiúhànjiēpǐnzhìguānxìzhīyánjiū
AT chenghsiangyu correlationstudybetweencapillaryprofileandqualityofgoldballbonding
AT yóuchéngxiáng correlationstudybetweencapillaryprofileandqualityofgoldballbonding
_version_ 1718317573637931008