| Summary: | 碩士 === 國立高雄第一科技大學 === 機械與自動化工程所 === 91 === Abstract
As 0.13μm or smaller electric line width has been applied to the Integrated Circuit (IC), the “Bonding Pad Pitch” has been shrunk from earlier 100μm to 50μm. While the reduction is contributive to lower production cost, it also greatly influences “Ball Shear Force”. This report focuses on the correlation between capillary profile changes (Tip Diameter, Chamfer Diameter, Inner Chamfer Angel and Cone Angle) and the quality of gold ball bonding.
First or all, I adopt gold ball size calculation to design the bonding ball size and then getting the machine parameters with “Thguchi Method”. Finally, “Central Composite Design” is used for the experiment of capillary parameters changed and bonding quality relationship. With “analysis of covariance”, “statically test” and “regression analysis” come out a regression equation that provides the 3-dimensional response diagram and contour plot. From the 3-dimensional response diagram, I reach a conclusion that tip diameter and cone angle of capillary parameter are the key factors that influence the bonding quality. As the tip diameter increases, size of ball increases but ball thickness decreases; ball sheer force increases first then decreases. As the cone angle decreased, the ball size increases and so does the ball sheer force, but ball thickness decreases. Experimental results can be applied to predict bonding quality and optimizing the capillary parameters in the condition of the decreased bonding pad pitch and when the modification of capillary parameter is needed. With modified capillary, bonding and measurement, it proves that experimental results were correct.
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