Effect of the thickness of Au-coating on the strength of BGA joints soldered by Bi-43Sn and Sn-9Zn systems after reflow, and electrolytic migration of Sn-contained binary solders in various solutions
碩士 === 國立中央大學 === 機械工程研究所 === 91 === Shear strength of the ball grid array (BGA) Bi-43Sn and Sn-9Zn solder balls re-flowed on the Ni/Au-coated Cu-pads was estimated. The strength of the joint between the re-flowed solder ball and the Ni/Au-coated pad was influenced by the thickness of the Au-coat...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/44908595041324031101 |