Temperature Uniformity of the Wafer in Rapid Thermal Processing
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 91 === The purpose of this research is to examine the temperature uniformity of a 300mm wafer under rapid thermal processing (RTP). The heat transfer in the RTP chamber under development at CSIST is considered. This study adopts the Monte Carlo method (MCM) to calc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/22692330561504970225 |