Study on underfill encapsulation of flip chip
碩士 === 國立成功大學 === 航空太空工程學系碩博士班 === 91 === The demands of electronic packages toward lower profile, lighter weight, and higher density of I/O leads to rapid expansion in the field of area array package. Based on this concept, development of flip chip technology attracts more attention than the tradit...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/41191369933963254041 |