| Summary: | 碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 91 === In this experiment, the Co-Cr-Pt-B magnetic thin film was used as material to find out the effect of different manufacturing processes. The magnetic thin film is deposited on Si substrate by Radio-Frequency Sputtering using composite target.
The different manufacturing processes used in this experiment are as follows: the addition and the thickness of Ti under-layer, different substrate temperature, and post annealing process including annealing temperature and annealing time.
Changing the thickness of Ti under-layer will directly affect the thickness of disordered layer while the thickness of this disordered layer will also affect the magnetic properties of thin film.
The higher the substrate temperature, the bigger grain size is after sputtering. However, the magnetic properties cannot be promoted significantly via rising substrate temperature.
The effect of post-annealing process is more obvious. The grain size grows up as the annealing temperature increases and a second phase (CoPt) begins to precipitate when the annealing temperature reaches 700℃. The magnetic properties of thin film are also enhanced with the increase of annealing temperature. The grain size grows up with annealing time, but the perpendicular coercivity tends to decrease while the annealing time is extended.
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