| Summary: | 碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 91 === Carbon Fiber/epoxy composite is one of the important thermal management materials but its disadvantages are relatively low thermal conductivity. In order to resolve this problem, physical vapor deposition (PVD) process was used to deposit copper films on carbon fiber/epoxy composite in this work.
The substrates have different thickness and fiber direction, and copper film was deposited on them in different film thickness. The thermal conductivity (K) of the substrates and the as-deposited samples is measured by laser flash and compared with the theoretical effective thermal conductivity (Keff).
The experimental result revealed that copper films would have good adhesion with the substrate and lower electrical resistivity by sputtering with bias voltage of -90V, so, it was the best sputtering condition.
The results also showed that the thermal conductivity of the substrate with fiber axis paralleling to heat flow (S⊥) will be as good as 3.6W/mk. With film thickness up to 40μm , it would increase to 4.91 W/mk. When the thickness of S⊥ decrease to 1mm, the K value would become 5.5W/mk which was 60% of the Keff value and increase 54% of the thermal conductivity of S⊥ itself.
|
|---|
