Interfacial Bonding Behavior between Sn-Ag-Cu Series Lead-free Solders and Cu/Ni-P/Au Substrate
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 91 === Abstract The interfacial bonding behavior between Sn-Ag-Cu series lead-free solders and Cu/Ni-P/Au substrates were investigated in this work, which includes the shear strength measurement and interfacial reaction. The solder compositions are Sn-3.2Ag-0.5C...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/62788210599217926763 |