Study of Increasing Thermal Conductivity of the AlN╱Epoxy Composites

• Main Authors: Shih-Liang Liu, 劉世量
• Other Authors: Shyan-Lung Chung
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/74013260631060146994

碩士 === 國立成功大學 === 化學工程學系碩博士班 === 91 === Some important properties for manufacturing semiconductor packaging are: high values of thermal conductivity, low values of dielectric constants, relatively low values of thermal expansion coefficient and low water uptake. Thus, in this study, AlN (Aluminum Nitride) was selected as the filler for an epoxy matrix to achieve increased performance of an EMC (Epoxy Molding Compound). In this thesis, we used aluminum nitride powders synthesized by our lab as fillers of Epoxy Molding Compound . Because of the advanced properties of AlN, it could improve the thermal conductivities of the EMC materials to satisfy the demand for high frequency and smaller chips. The production process of EMC specimens in this research was different from the process of low pressure transfer molding. In this research, the catalyst was liquid so that the process of blend could be changed to improve the thermal conductivities. In addition, this research also compared the variables, such as coupling agent, post-cured, diameter of AlN, oxygen content of AlN and surface treatment of AlN etc., that affect the specimens. The thermal conductivity of the specimens could achieve higher than 7 W/m-K if filling 75 wt% AlN powders, which the diameter and oxygen content were 14.33 micron and 0.4065 wt% respectively and were coated a thin layer of TiO2, and EMC specimens were post-cured. Besides, comparing the AlN that synthesized by our lab with commercial ones, it showed that the AlN synthesized by our lab was conformed to the commercial requirement.