Stress Analysis of Lead-Free Solders with Under Bump Metallurgy for Wafer Level Chip Scale Package
碩士 === 國立成功大學 === 工程科學系專班 === 91 === The wafer level chip scale package (WLCSP) has increasingly become popular due to its wafer-sized compact package. In the WLCSP, the under bump metallurgy (UBM) which connects the solder joint and the chip, is crucial for the package reliability. Additionally, th...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/20109633855213766610 |