| Summary: | 碩士 === 逢甲大學 === 機械工程學所 === 91 === Abstract
Among all piezoelectric materials,（PZT（Pb(ZrxTi1-x)O3））has better piezoelectric performance, and combines easily with the development of micromachining. So it is broadly used in the design of sensors and actuators in Micro-Electron-Mechanical-System（MEMS）. The purpose of this thesis is using sol-gel method fabricate PZT thin films and actuate surface micromachined cantilever-beam. In particular, the sacrificial layer is used to make micro cantilever-beam.
For making PZT micro cantilever-beam, it contains three parts：elastic structure and sacrificial layer, piezoelectric transducer layer and top and bottom electrodes. CVD deposition is used to make silicon dioxide, poly-silicon and silicon nitride. PVD sputtering and evaporator are adopted to make Ti and Pt electrodes. Sol-Gel processing is used to make PZT thin film. The photolithography and etching technique associated with surface micromachining can be used to pile up micro structures. Finally, photo resist is effective to protect whole construction prior to wet etching. Then the anisotropic wet etching for undercutting sacrificial layer can achieve the production of micro cantilever-beam .
During the process of etching sacrificial layer, the width of micro cantilever-beam is too large to etch the layer completely by HF, and the photo resist coating on the device can not protect the beam for a long time. The measurement of displacement is used by DC power supply machine associated with a laser displacement meter. It founds that the maximum displacement of the beam with size of 200μm×50μm is 0.1219μm ,and the beam with size of 200μm×800μm is 0.1405μm.
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