| Summary: | 碩士 === 逢甲大學 === 紡織工程所 === 91 === ABSTRACT
In this study, the carbon fiber reinforced composite materials were used as the substrates for electroless copper plating. The surface of the substrates was ground with different abrasive paper (physical roughness) and/or chemical roughness, and then performed electroless copper plating with different plating bath conditions of pH value. It is hope to find the optimum pretreatment condition that could get higher adhesion strength between the copper film and the composite substrates. In addition, microscope was used to observe the situation of the composite’s roughness and the bonding behavior between composite and copper film. Based on the experimental results, the surface of composite was treatment by chemical etching exhibited higher adhesion strength of 2.63 MPa.
The optimum operating conditions for the copper electroless plating have been obtained, including concentrations of copper salt, ethylenediamine tetraacetic acid, formaldehyde solution, and sodium hydroxide of the plating bath. By using the initial rate method, the kinetics of reaction and the activation energy of this study were obtained, shown as the following:
Ea= 2588.302 cal/mol
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