System Integration of Die Bonder and Force Control
碩士 === 中原大學 === 機械工程研究所 === 91 === The object of this research is FOTON type Die Bonder machine. The design of control portion is use the distributed control configuration to replace the original logic controller, to accomplish the motion of wafer handling and die access. That use programmable logic...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2003
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| Online Access: | http://ndltd.ncl.edu.tw/handle/6wx6q5 |