Using diethylphosphite as a thermally latent curing agent for epoxy resins and the properties of the cured epoxy resins
碩士 === 中原大學 === 化學工程研究所 === 91 === Abstract Diethylphosphite (DEP) can be used as a thermally latent curing agent for epoxy resins by means of the formation of phosphonic acid active groups through the de-ethanol reaction of DEP. The mechanism and activation energy of the curing reaction and the t...
Main Authors: | Wen-Lung Wei, 魏文龍 |
---|---|
Other Authors: | Ying-Ling Liu |
Format: | Others |
Language: | zh-TW |
Published: |
2003
|
Online Access: | http://ndltd.ncl.edu.tw/handle/50906950689403323195 |
Similar Items
-
Using diethylphosphite as a thermally latent curing agent for epoxy resins and the properties of the cured epoxy resins
by: Wen-Lung Wei, et al.
Published: (2003) -
Properties and Curing Kinetics of Epoxy Resins Cured by Chitosan
by: Balasubramani, Praveen Kumar
Published: (2016) -
The development of novel curing agents for epoxy resins
by: Liu, Shuyuan
Published: (1996) -
Development of novel curing agents for epoxy resins
by: Jepson, Peter
Published: (2001) -
Properties study of ultraviolet curing epoxy resins
by: Chen, Weihsien, et al.
Published: (2012)