The Out-of-Plane Displacement Measurement of Electronic Speckle Pattern Interferometry on Sandwich Plates with Insert

• Main Author: 林華龍
• Other Authors: ime_hsj
• Format: Others
• Language: zh-TW
• Published: 2003
• Online Access: http://ndltd.ncl.edu.tw/handle/83473756078303133773

碩士 === 國立中正大學 === 機械系 === 91 === This research presents the construction and operation of an electronic speckle pattern interferometer (ESPI) applied to sandwich plates with inserts. Proposed ESPI is a full-field and non—destructive testing that can measures tiny out-of-plane displacement in the elastic region, without wasting specimen. ESPI has never been applied on measurement of sandwich plates with inserts. In the experiment of this study, a modified Michelson interferometer is shown. There are two results of the experiment in this study. The first result indicates that the strength of single-inserted sandwich will increase as the diameter of potting material is increasing, but having the penalty of weight increase. The second result indicates that the out-of-plane displacements for two-inserted sandwich loaded by the same forces will decrease as the spatial interval of the two inserts is increasing. For validation purpose, the finite element method (FEM) analysis was introduced to compare with the result of ESPI. Comparison between the results of ESPI and FEM revealed a convincing agreement. The results of this study could be applied on designing the sandwich with inserts in the future.