THERMAL PERFORMANCE ANALYSIS OF HEAT SINK FOR ELECTRONIC PACKAGE
碩士 === 元智大學 === 機械工程學系 === 90 === Both numerical and experimental approached have been used to investigate the thermal performance of heat sinks for electronic packages. The effects of operating parameters include inlet air velocity and temperature, size and power of heat source, different geometrie...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/16767088761039723223 |