Plugging ink improvement study
碩士 === 元智大學 === 化學工程學系 === 90 === This study researches into the factors of the plugging ink crack when it is used in the print circuit board by high-temperatured procedure. We design a weight loss experiment. We can get the diffusion coefficient of plugging ink is 2.6*10-5...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/46349284181784471377 |