| Summary: | 碩士 === 大同大學 === 通訊工程研究所 === 90 === Due to that the differential transmission line has the effect of “common-mode rejection” to the noise signal, it is suitable for signal of high speed and low voltage to propagate for long distance. However, in the high-speed digital system,
for instance, the equipments of telecommunication transmission, the number of kinds of address/data bus will increase along with the raise of complexity, among which the differential signal line structures are much more complicated. Furthermore, in the system of high density, a large amount of the transmission line will lead to huge number of I/O pins in
package of semiconductor devices, for example, of 500 ∼ 600 pins. To overcome this problem, in other words, to cut down the pin number of ASIC, a new method in engineering is to combine one of each pair of the differential transmission line from transmitter to receiver in the light of one group of differential transmission address/data bus.
The purpose of this thesis is to put forward the model establishment and crosstalk analysis for this kind of transmission line structure. In the experiment, circuit board plotter and multi-layer press are used to make the thin boards of multi-layer and multi-conductor, and the prototypes of different length and line spacing are made for analyzing the relation between the parameters of the structure and the coupling of signals. In the simulation, to economize the calculated memory of computer and simulated time, lumped element equivalent circuit is applied for the establishment of model. In addition, modeling of bend is presented in detail in this thesis for considering the measurement calibration. At the last, the results of simulation will be proved by the result of measurement.
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