| Summary: | 碩士 === 國立臺北科技大學 === 冷凍與低溫科技研究所 === 90 === The compact rate were increased following developed of IC technology in recent years and the conductor output port（signal、source、ground）were also increased relatively. Hence the Flip-Chip Package were had become the guideline technology of multi-mold package. The Flip-Chip Package technology could provide designer combined many techniques in design, for example, combining activity and passive components、increasing compact、improving system efficiency、reducing costs. The Flip-Chip Package technology in signal transporting were mainly used material bump as the signal transporting components from chips to base board, so the growth of metal bump chips on chips were relation with the height of IC package virtuous.
The producer and facilities of wafer manufacture is closely in semiconductor making technology. It would stopped the future technology in promoted if we only had producer without facilities technology. In order to suit the uniform metal bump sizes of the Flip-Chip Package technology, this study is aimed at the non-electroless ways of oxidation-reduction ,using water solution tank to proceed research and improving, because of the flow space changed would affect one of the importance reasons of metal bump growth on wafer inside the water solution tank, so wet bench acted as very important role in Flip-Chip Package producer. This study is mainly utilizing the package software of PHOENICS to do as numerical simulation analysis, and proved by experiment data, then found the optimum operation condition and geometry designing.
This study is aimed at four kinds of different styles designed tanks to proceed analyze, and to establish experiment data to be used as determining the good and bad of flow space inside tanks. This study is aimed at the defect inside of the tank flow space characteristic of tradition single tank style of wet bench to bring up utilizing guide-vane changed outlet direction and increased symmetrical inlet, by way of improving the single inlet and outlet modes caused no uniform phenomenon in traditional old mode of tank. By way of increasing the flow uniform rate to reach the result of good wafer metal bump, and to find the optimum tank mode designed by result analysis, so the mention of this study innovating design and reality application of feasible were high greatly. It can provide manufacturer and user a new reference aspect.
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