Rapid and locally selective bonding of Anodic Bonding
碩士 === 國立臺北科技大學 === 製造科技研究所 === 90 === The anodic bonding, a non-intermediate bonding technology that is mainly used in glass to silicon wafer bonding, has become one of the important steps in the manufacturing process of MEMS (Microelectromhanical Systems). As a result of tight bonding without any...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/47174478752454597237 |