The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process

The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process

碩士 === 國立清華大學 === 化學工程學系 === 90 ===

Bibliographic Details
Main Authors: Yung-Yuan Wang, 王永元
Other Authors: Rong-Yen Chang
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/28396864227371138583
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spelling ndltd-TW-090NTHU00630152015-10-13T10:34:05Z http://ndltd.ncl.edu.tw/handle/28396864227371138583 The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process 表面張力與接觸角變化對覆晶封裝底部填膠流動的影響 Yung-Yuan Wang 王永元 碩士 國立清華大學 化學工程學系 90 Rong-Yen Chang 張榮語 2002 學位論文 ; thesis 97 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 化學工程學系 === 90 ===
author2 Rong-Yen Chang
author_facet Rong-Yen Chang
Yung-Yuan Wang
王永元
author Yung-Yuan Wang
王永元
spellingShingle Yung-Yuan Wang
王永元
The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process
author_sort Yung-Yuan Wang
title The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process
title_short The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process
title_full The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process
title_fullStr The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process
title_full_unstemmed The Effect of Surface Tension and Contact Angle on the Filling Behavior of Flip-Chip Underfill Dispensing Process
title_sort effect of surface tension and contact angle on the filling behavior of flip-chip underfill dispensing process
publishDate 2002
url http://ndltd.ncl.edu.tw/handle/28396864227371138583
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AT wángyǒngyuán effectofsurfacetensionandcontactangleonthefillingbehaviorofflipchipunderfilldispensingprocess
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