The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System

The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System

碩士 === 國立清華大學 === 化學工程學系 === 90 ===

Bibliographic Details
Main Authors: Ching-Shun Chou, 周進順
Other Authors: Chi-Chao Wan
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/74751043478416301714
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spelling ndltd-TW-090NTHU00630082015-10-13T10:34:05Z http://ndltd.ncl.edu.tw/handle/74751043478416301714 The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System 鈀膠體系統直接電鍍速率促進之研究 Ching-Shun Chou 周進順 碩士 國立清華大學 化學工程學系 90 Chi-Chao Wan Yun-Yung Wang 萬其超 王詠雲 2002 學位論文 ; thesis 108 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 化學工程學系 === 90 ===
author2 Chi-Chao Wan
author_facet Chi-Chao Wan
Ching-Shun Chou
周進順
author Ching-Shun Chou
周進順
spellingShingle Ching-Shun Chou
周進順
The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System
author_sort Ching-Shun Chou
title The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System
title_short The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System
title_full The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System
title_fullStr The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System
title_full_unstemmed The Enhanced Study of Direct Copper Plating Rate for Pd Colloidal System
title_sort enhanced study of direct copper plating rate for pd colloidal system
publishDate 2002
url http://ndltd.ncl.edu.tw/handle/74751043478416301714
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