The Study of Mechanical Properties of Solder Alloys
碩士 === 國立東華大學 === 材料科學與工程學系 === 90 === Based on the demand of miniaturization of 3C products, it is expected that traditional solder alloys will be applied in the environment of high density packaging, and the reliability of new generation solder alloys will become the issues in the near future. Th...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/73194776230250965092 |