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碩士 === 國立中央大學 === 光電科學研究所 === 90 === Abstract We have deposited Ta2O5 and SiO2 films by ion-beam sputtering. By measuring Ta2O5 and SiO2 films, we find that thin films deposited by ion-beam sputtering have several advantages. 1.High packing density. 2.Refractive index steady. 3.Low scattering loss....

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Bibliographic Details
Main Authors: Huang-Ping Chiu, 邱煥評
Other Authors: Cheng-Chung Lee
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/81693703786751476275
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spelling ndltd-TW-090NCU056140082015-10-13T10:12:40Z http://ndltd.ncl.edu.tw/handle/81693703786751476275 none 離子濺鍍膜厚均勻性之研究 Huang-Ping Chiu 邱煥評 碩士 國立中央大學 光電科學研究所 90 Abstract We have deposited Ta2O5 and SiO2 films by ion-beam sputtering. By measuring Ta2O5 and SiO2 films, we find that thin films deposited by ion-beam sputtering have several advantages. 1.High packing density. 2.Refractive index steady. 3.Low scattering loss. 4.Low absorption loss. 5.Amorphous. Based on these advantages, we establish the method to describe and analyze thickness distribution. We use a concept that the density distribution of ion beam projecting on target to simulate actual thickness distribution. In simulation process, we divide the projecting surface source of target to many uniform emissive sources. A correct thickness distribution by using the concept has been successfully described. Cheng-Chung Lee 李正中 2002 學位論文 ; thesis 48 zh-TW
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description 碩士 === 國立中央大學 === 光電科學研究所 === 90 === Abstract We have deposited Ta2O5 and SiO2 films by ion-beam sputtering. By measuring Ta2O5 and SiO2 films, we find that thin films deposited by ion-beam sputtering have several advantages. 1.High packing density. 2.Refractive index steady. 3.Low scattering loss. 4.Low absorption loss. 5.Amorphous. Based on these advantages, we establish the method to describe and analyze thickness distribution. We use a concept that the density distribution of ion beam projecting on target to simulate actual thickness distribution. In simulation process, we divide the projecting surface source of target to many uniform emissive sources. A correct thickness distribution by using the concept has been successfully described.
author2 Cheng-Chung Lee
author_facet Cheng-Chung Lee
Huang-Ping Chiu
邱煥評
author Huang-Ping Chiu
邱煥評
spellingShingle Huang-Ping Chiu
邱煥評
none
author_sort Huang-Ping Chiu
title none
title_short none
title_full none
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publishDate 2002
url http://ndltd.ncl.edu.tw/handle/81693703786751476275
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