Effect of Au and Ni/Au coatings on the electrolytic migration of Cu-conductors, and effect of Au coatings on joint strength of BGA for Sn-0.7Cu and In-48Sn solder after reflow
碩士 === 國立中央大學 === 機械工程研究所 === 90 === Effects of Au and Ni/Au coatings on the electrolytic migration of copper conductors have been studied. The migration of the copper conductors in dionized water, 0.01M NaCl and (NH4)2SO4 solutions at a bias of 5V was inhibited by coating a layer of Au in thic...
Main Authors: | Guh-Yaw Jang, 張顧耀 |
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Other Authors: | Jing-Chie Lin |
Format: | Others |
Language: | en_US |
Published: |
2002
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Online Access: | http://ndltd.ncl.edu.tw/handle/58856788558324436154 |
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