Effect of Au and Ni/Au coatings on the electrolytic migration of Cu-conductors, and effect of Au coatings on joint strength of BGA for Sn-0.7Cu and In-48Sn solder after reflow

碩士 === 國立中央大學 === 機械工程研究所 === 90 === Effects of Au and Ni/Au coatings on the electrolytic migration of copper conductors have been studied. The migration of the copper conductors in dionized water, 0.01M NaCl and (NH4)2SO4 solutions at a bias of 5V was inhibited by coating a layer of Au in thic...

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Bibliographic Details
Main Authors: Guh-Yaw Jang, 張顧耀
Other Authors: Jing-Chie Lin
Format: Others
Language:en_US
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/58856788558324436154