Experimental and Finite Element Analyses on Wire Bonding
碩士 === 國立交通大學 === 機械工程系 === 90 === Wire bonding is the most popular interconnection method in electronic packaging. The controlled parameters significantly affect the bonding strength when the tiny golden wires(25μm in diameter) are used in this process. This study examines how parameters and bondin...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2002
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56788170089122720277 |
| Summary: | 碩士 === 國立交通大學 === 機械工程系 === 90 === Wire bonding is the most popular interconnection method in electronic packaging. The controlled parameters significantly affect the bonding strength when the tiny golden wires(25μm in diameter) are used in this process. This study examines how parameters and bonding strength are related by performing experimental and finite element analyses.
Bonding experiments were conducted to examine how various combinations of controlled parameters affect both the forming of golden ball connection and the resulting bonding strength. Moreover, finite element simulations on the wire bonding were performed, with the results compared with those of experimental works.
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