| Summary: | 碩士 === 國立交通大學 === 電信工程系 === 90 === Part I of this thesis describes the analyses, design, and applications of a patent pending technology called complementary-conducting-surface (CCS) integrated circuit guiding structure. The CCS structure is made of a metal pad with connecting branches while the ground plane underneath the metal pad is etched complementarily. This structure has been numerically computed by the finite-element method. The transmission parameters, such as characteristic impedance and propagation constant, have been extracted for the practical circuit design. The advantages of low loss, moderate impedance, and uniplanar features make the CCS structure a promising candidate as a slow-wave transmission line. Moreover, by the two-dimensional periodic array arrangement of the unit cells, a compact CCS transmission line can be constructed to reduce the dimension of distributed components in integrated circuits (ICs). Two applications on the monolithic ICs technology are addressed. The first is a fully integrated 5.2 GHz oscillator, which is based on a new distributed circuit design methodology, in a 0.25-mm 1P5M CMOS technology. Measured results reveal that an output power of —25.3 dBm with the phase noise of —96.33 dBc/Hz at 1 MHz offset from the carrier is achieved. The second is a DC-60 GHz 12 dB gain distributed amplifier in a 0.15-mm GaAs PHEMT technology. The circuit draws a current of 89 mA from a supply of 8 V and occupies an area of 1.2 mm × 1.2 mm. The above two applications successfully illustrate the potential of making high-performance, low-lost, and compact microwave and millimeter-wave monolithic ICs using the CCS technology.
Part II of this thesis describes a Ka-band sub-harmonic mixer utilizing a new planar rectangular waveguide filter. The circuit is designed to operate at an LO frequency of 15 GHz, an IF range of 1.5 GHz to 3 GHz, and an RF range of 31.5 GHz to 33 GHz. A planar waveguide filter is placed at the RF side of the mixer to reject the image signal and to provide good RF to LO/IF isolation. The proposed filter is fabricated using conventional multi-layer printed-circuit-board (PCB) fabrication process and employs two planar microstrip-to-waveguide mode converters between the two transmission structures. The measured maximum upper side band (USB) up-conversion loss of the mixer over the complete frequency range is 11.4 dB at an LO power of 4 dBm while the minimum USB up-conversion loss is 9.7 dB at an IF of 2 GHz. This attractive performance of the mixer demonstrates the feasibility of making all-planar, well-performing, and low-cost millimeter-wave modules via the multi-layer PCB process.
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