The Application of Semiconductor Heterostructures in Cooling Chips

碩士 === 國立交通大學 === 電子工程系 === 90 === The purpose to this thesis is mainly to develop a sort of new cooling chips, fabricated with the quantum well structures of III-V compound semiconductor and called “Thermionic coolers”. There is a better cooling performance for thermionic coolers than that for conv...

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Bibliographic Details
Main Authors: Tien-Cheng Lee, 李天成
Other Authors: Chien-Ping Lee
Format: Others
Language:zh-TW
Published: 2002
Online Access:http://ndltd.ncl.edu.tw/handle/95462741634237014642

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