| Summary: | 碩士 === 國立交通大學 === 材料科學與工程系 === 90 === We develop an easy, low cost, and low temperature optoelectrionic hermetic packaging technology utilizing eutectic SnPb solder and Cr/Ni/Cu bonding pad. Bonding characteristic of our design is investigated on three different setups: silicon-silicon, silicon-glass, and glass-glass samples pairs. For all samples, hermeticity can be achieved at 200oC easily. Our design of bonding pads does not show dewetting during or after the reflow process. By utilizing solder materials, we also observed the characteristic of self-alignment. Because the alignment for sample pairs before bonding process is conducted through visual aligning, original misalignment might be more than 100 mm. With the pulling force of surface tension by solder during reflow process, the final misalignment of our samples were able to self-align to obtain a final misalignment of less than 100mm or even less than 20mm. Bonding strength of the three setups ranges from 3 MPa to 10 MPa. Among the three setups, glass-glass sample pairs appear to have the strongest bonding strength. This low temperature and cost effective soldering process have demonstrates its feasibility in optoelectronic packaging.
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